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MSV
7.-11.10. 2019

International Engineering Fair

Siemens, s.r.o.

 

Digital Twin Accelerates Your Production

This year, Siemens will present a comprehensive solution for increasing manufacturing efficiency along the entire value chain, from its design through production to servicing. The Siemens portfolio of products and solutions is absolutely unique in its complexity.

Assembly machine and its digital twin

Siemens will present the story behind end-to-end product lifecycle management using an example of an assembly machine for smartphones. The machine was “born” as follows: while its virtual version was being designed and commissioned in Germany, its real twin was simultaneously being manufactured in China. The virtual “dummy run” of all features of the machine and production tact of the line helped save more than 30% of time compared to the standard procedure.

MindSphere – The Internet of Things (IoT) Solution

With the connection to Mindsphere – the cloud-based, open IoT operating system from Siemens – the user will always know what is going on with the machine and can in many cases react to potential failures well in advance. With the new MindSphere platform, you can benefit from the value of the data generated from your manufacturing process and transform it into valuable information, which is a key to your business success. MindSphere will help you optimise your operations, increase  flexibility, save money and create new business models.

www.siemens.cz/msv

Date: 12 Sep 2018 08:46:00

Concurrently with

Transport and Logistics
7.-11.10. 2019


ENVITECH
7.-11.10. 2019

 

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